Title:
METALLIC MOLD DEVICE FOR RESIN SEALING AND MOLDING ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP3727140
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To easily and surely fix and efficiently mount a hollow seal member for interrupting air on the groove of the upper metallic mold of both upper and lower molds, and to efficiently prevent the hollow seal member from being detached from the upper metallic mold at the time of resin-sealing and molding by the upper and lower molds.
SOLUTION: In a metallic mold device for resin-sealing and molding, an electronic component in which a hollow seal member 30 is provided with a grasping part 32, the grasping part 32 is interposed between mounting members 16, so that the hollow seal member 30 can be embedded in a groove 22 of an upper mold face. Then, at the time of mold clamping the upper and lower molds 1 and 2 with the expanded hollow seal members 30 (30a) expanded by a pressurizing mechanism 24, at least a part 3, a resin passage 9, and a cavity are turned into an open air interrupting state, so that an open air interrupting space if formed. Thus, the air which remains inside can be forcedly sucked and discharged to the outside by an evacuating mechanism, and an electronic component on a lead frame an be resin sealed and molded.
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Inventors:
Miyagawa Shigeru
Yoshihisa Kawamoto
Yoshihisa Kawamoto
Application Number:
JP15597597A
Publication Date:
December 14, 2005
Filing Date:
May 28, 1997
Export Citation:
Assignee:
towa corporation
International Classes:
B29C45/34; B29C45/02; B29C45/26; H01L21/56; (IPC1-7): H01L21/56; B29C45/02; B29C45/34
Domestic Patent References:
| JP62134251A | ||||
| JP9123205A | ||||
| JP8222316A | ||||
| JP7317908A |