To provide a method for tightly bonding an epoxy adhesive to a metal by making a curing agent used for epoxy adhesive, especially an amine based curing agent, hard to react with a coated film of a triazinethiol compound to keep molecular bonding of each triazinethiol compound.
The invention relates to the method for adhesion of metal and an adherend comprising covering a surface of a metal with the triazinethiol compound, coating an epoxy compound having at least two epoxy groups in the molecule on the metal surface coated with the triazinethiol compound, heating the epoxy compound and then coating an epoxy adhesive mixed with the curing agent on the surface of the metal wherein the adherend is adhered to the surface of the metal through the epoxy adhesive.
OMICHI WATARU
SASAKI MORIAKI
KM AKUTO KK