To provide a method and an apparatus for resin coating, with which waviness and warp of a workpiece is appropriately removed and the ground workpiece is formed to be strictly flat as the gravity is taken into consideration.
A surface 1a of a wafer 1 is sucked to a sucking surface 24a of a suction part 24 of a pressing pad 23, and deformation of the wafer 1 is corrected. Then, the corrected wafer 1 is mounted on a liquefied resin P1 and pressed. Next the resin P1 is hardened after the pressing pad 23 is released from the wafer 1 to cause deformation for restoring the warp or the like on the wafer 1. A strictly flat state is obtained after grinding without permitting the deformation due to the gravity, by causing the resin P1 to deform from the corrected condition.
COPYRIGHT: (C)2010,JPO&INPIT
ONODERA HIROSHI
SHIMOTANI MAKOTO
| JP2001110765A | 2001-04-20 | |||
| JP2006263837A | 2006-10-05 | |||
| JPH11111653A | 1999-04-23 | |||
| JP2007134371A | 2007-05-31 | |||
| JP2000005982A | 2000-01-11 | |||
| JP2001110765A | 2001-04-20 | |||
| JP2006263837A | 2006-10-05 |