Title:
METHOD AND APPARATUS FOR COMPONENT RECOGNIZING
Document Type and Number:
Japanese Patent JP3883279
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain the positional information at a joint of an electronic component accurately while ensuring mounting thereof by deviating a noise object existing closely to the joint of a lead or an electrode on the electronic component mounting surface from the measuring region of reflected light detected at a height detecting section.
SOLUTION: An electronic component having the joint of a lead, or the like, is sucked to a heat section 7 and moved onto a height sensor 8 provided with two systems of semiconductor position detecting elements PSD 17a, 17b. Light from a laser 10 is condensed and focused through a lens 11, deflected by a polygon mirror 12, and projected to the component 2 by converting the optical path through an F-θ lens 15. Reflected light is passed through lenses 16a, 16b to be focused on PSDs 17a, 17b and output signal 18a, 18b for measuring the height of laser reflecting surface are generated therefrom. Since a height region is preset in a height measurable region and the height is detected only in that range, a noise object is deviated therefrom and not detected.
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Inventors:
Masamichi Morimoto
Eiichi Hachiya
Atsushi Tanabe
Earth emblem
Eiichi Hachiya
Atsushi Tanabe
Earth emblem
Application Number:
JP4784998A
Publication Date:
February 21, 2007
Filing Date:
February 27, 1998
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H05K13/04; H05K13/08; (IPC1-7): H05K13/04; H05K13/08
Domestic Patent References:
| JP10051195A |
Attorney, Agent or Firm:
Aoyama Aoi
Mitsuo Wada
Mitsuo Wada
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