To provide a casting method and a casting apparatus which allow casting of a silicon ingot making effective use of the height of a casting mold, and solve the following problem; when raw material is additionally supplied to molten silicon melted in a casting mold, a mold release agent of the casting mold is peeled or damaged to lower yield due to crazing of an ingot and inclusion of the mold release agent.
The method for manufacturing a semiconductor ingot includes: melting semiconductor material in a casting mold by heating with a casting mold heating means; supplying and melting new semiconductor material; and solidifying the resulting semiconductor melt, wherein the new semiconductor material is supplied in a preheated state into the casting mold.
JP2002193609A | 2002-07-10 | |||
JP2001097707A | 2001-04-10 |