Title:
METHOD AND APPARATUS FOR MARKING SEMICONDUCTOR WAFER WITH LASER
Document Type and Number:
Japanese Patent JP3685837
Kind Code:
B2
Abstract:
PURPOSE: To prevent spark of semiconductor wafer by laser beam from spreading to the effective area of the semiconductor wafer so as to eliminate the contamination of the effective area of the semiconductor.
CONSTITUTION: In a marking method for a semiconductor wafer by means of laser, a step of setting a semiconductor wafer 13 on a stage 16, a step of shielding the effective region of the semiconductor wafer from dust particles generated by marking of the semiconductor wafer 13 by means of a laser beam 12, and a step of marking the semiconductor wafer 13 by means of the laser beam 12 are applied.
Inventors:
Norito Nara
Application Number:
JP13202695A
Publication Date:
August 24, 2005
Filing Date:
May 30, 1995
Export Citation:
Assignee:
Miyazaki Oki Electric Co., Ltd.
Oki Electric Industry Co., Ltd.
Oki Electric Industry Co., Ltd.
International Classes:
B41J2/44; B23K26/00; B41J2/00; B41K3/36; H01L21/02; H01L23/00; (IPC1-7): H01L21/02; B23K26/00; B41J2/44; B41K3/36; H01L23/00
Domestic Patent References:
| JP58029437U | ||||
| JP8111358A |
Attorney, Agent or Firm:
Mamoru Shimizu
Makoto Kawai
Makoto Kawai
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