METHOD AND APPARATUS FOR PROCESSING RESIN STRUCTURE

Title:

METHOD AND APPARATUS FOR PROCESSING RESIN STRUCTURE

Document Type and Number:

Japanese Patent JP2005262617

Kind Code:

A

Abstract:

To provide a method for processing a resin structure having a minute structure which can remove burrs without changing the shape of the minute structure and an apparatus for the method.

The method for processing the resin structure deals with, for example, a traveling chip 1 for observation which is made of a thermoplastic resin and has fine holes 21 and 22 positioned in the vicinity of the minute structure and in which the burrs 5 are formed in the holes. First, metal bodies 61 having shapes corresponding to the holes 21 and 22 are inserted into the holes 21 and 22. Next, the metal bodies 61 are heated temporarily to melt the burrs 5.

Inventors:

OGURO NAOTERU
FUKUOKA TAKASUKE
GOSHOO YASUHIRO
SEKI KOJI

Application Number:

JP2004077858A

Publication Date:

September 29, 2005

Filing Date:

March 18, 2004

Export Citation:

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Assignee:

YAMATAKE CORP

International Classes:

G01N33/48; B29C37/02; B29C45/00; B29C45/36; (IPC1-7): B29C37/02; G01N33/48

Attorney, Agent or Firm:

Ken Ieiri

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