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Title:
METHOD AND APPARATUS FOR PROJECTION EXPOSURE
Document Type and Number:
Japanese Patent JP3408118
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To reduce the positioning time, without lowering the adjusting accuracy about the focus deviation and inclination deviation on a wafer surface by independently setting the measuring start timings according to the position of a target region to be exposed within a substrate.
SOLUTION: A controller 23 outputs specified driving instruction to an X-Y stage driver 20, based on measured coordinate values from a stage interferometer 21 and positions a wafer 3 having a region to be exposed on an X-Y stage 12 at a desired position of the X-Y coordinate system. The stage driver 20 drives the stage 12 while the interferometer 21 measures the coordinate positions one after another. Drivers 9, 10, 11 independently move a Z-stage 8 up and down to adjust the focus deviation and inclination deviation.


Inventors:
Satoshi Akimoto
Application Number:
JP19203497A
Publication Date:
May 19, 2003
Filing Date:
July 03, 1997
Export Citation:
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Assignee:
Canon Inc
International Classes:
G03F7/20; G03F7/207; G03F9/00; H01L21/027; (IPC1-7): H01L21/027; G03F7/207
Domestic Patent References:
JP6196386A
JP6283403A
JP4350925A
JP4221813A
JP4116414A
Attorney, Agent or Firm:
Tetsuya Ito