Title:
METHOD AND APPARATUS FOR RECOVERING SOLDER
Document Type and Number:
Japanese Patent JP3444557
Kind Code:
B2
Abstract:
PURPOSE: To eliminate the cause of lead poisoning by recovering solder from a printed board since there is a fear of the poisoning when drinking subsoil water impregnated with the lead of solder adhered to the board and eluted by acidic rain when a domestic electric product is discarded due to its trouble and hence the board soldered with its electronic component is discarded.
CONSTITUTION: A method for recovering solder comprises the steps of dipping a printed board removed from a domestic electric product in oil becoming a high temperature, spraying the oil of energy to the soldered surface of the board in the oil, and wiping OFF the solder. A solder recovering apparatus 1 comprises an electric heater 6 for heating oil in a body 2, a jet unit for injecting the oil, a conveying belt 12 for conveying a printed board under oil liquid level 11, and a retaining belt 14 feeding to retain the board P from above.
Inventors:
Yoshihiro Nishibori
Application Number:
JP15546894A
Publication Date:
September 08, 2003
Filing Date:
June 15, 1994
Export Citation:
Assignee:
Senju Metal Industry Co., Ltd.
International Classes:
B23K37/00; B23K1/00; B23K1/018; H05K3/34; H05K3/22; (IPC1-7): H05K3/34; B23K1/00; B23K1/018; B23K37/00
Domestic Patent References:
| JP63249396A | ||||
| JP63205993A | ||||
| JP1112047U | ||||
| JP4887552U |
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