Title:
METHOD OF APPLYING SOLDER TO PAD
Document Type and Number:
Japanese Patent JP3691972
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method of applying solder to a pad which is excellent in wettability and where spare solder can be formed.
SOLUTION: A solder applying method is carried out through a manner where a solder 22 is supplied to a pad 18 by feeding solder paste 16 to the pad 18 surrounded with a protective insulating layer 12 and heating it for reflow, where the temperature rise rate of the board 10 is set at 14°C/minute to 17°C/ minute in a temperature rise region from the temperature of the board 10 lower than a melting point of solder by about 7°C to the temperature higher than the former temperature by about 7°C when the board 10 is heated for reflowing in a reflow oven, and the board 10 is primarily heated from below its rear side.
Inventors:
Toshiyuki Nakata
Yasuo Iwasaki
Yoshihito Okuwaki
Yasuo Iwasaki
Yoshihito Okuwaki
Application Number:
JP29861798A
Publication Date:
September 07, 2005
Filing Date:
October 20, 1998
Export Citation:
Assignee:
富士通株式会社
International Classes:
H05K3/34; H01L21/52; (IPC1-7): H05K3/34; H01L21/52
Domestic Patent References:
| JP8139438A | ||||
| JP6037440A | ||||
| JP3106261U | ||||
| JP64027794A | ||||
| JP8288640A | ||||
| JP6252152A |
Attorney, Agent or Firm:
Takao Watanuki
Horimai Kazuharu
Horimai Kazuharu
Previous Patent: IMMUNO-CHROMATOGRAPHY APPARATUS AND MEASURING METHOD
Next Patent: METAL MATERIAL ORIGINAL PLATE
Next Patent: METAL MATERIAL ORIGINAL PLATE