Title:
METHOD FOR BONDING FLOOR MATERIAL
Document Type and Number:
Japanese Patent JPH05163477
Kind Code:
A
Abstract:
PURPOSE: To enable adhesion under operation environment excellent in aspects of labor hygiene in adhesion of a floor material.
CONSTITUTION: One pack type solvent-free reactive urethane-based adhesive is applied to floor base materials and/or floor materials to adhesively bond these materials or one pack type solvent-free reactive modified silicone-based adhesive is applied to the floor base material and/or floor material to adhesively bond the material to a floor.
Inventors:
KISHIMOTO MASAAKI
MAKINO JUNZO
OKUNO HIDEKAZU
MAKINO JUNZO
OKUNO HIDEKAZU
Application Number:
JP35109191A
Publication Date:
June 29, 1993
Filing Date:
December 11, 1991
Export Citation:
Assignee:
CEMEDINE CO LTD
International Classes:
E04F15/00; C09J175/00; C09J175/04; C09J183/00; C09J183/04; (IPC1-7): C09J175/04; C09J183/04; E04F15/00
Other References:
BOND TECHNICAL REPORT
Attorney, Agent or Firm:
Shoji Ishihara
Previous Patent: JPS5163476
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