Title:
METHOD OF BONDING SEMICONDUCTOR CHIP ELECTRODE
Document Type and Number:
Japanese Patent JP2010010383
Kind Code:
A
Abstract:
To provide a bonding method using a high temperature adhesive hardly influenced by the surface condition of an electrode formed on a semiconductor chip.
The electrode of the semiconductor chip is bonded by application of an adhesive and flux for soldering and by curing them in a nitrogen atmosphere.
Inventors:
NAKAGAWA HIROSHI
TANAKA YASUNORI
FUKUDA KENJI
AOYAGI MASAHIRO
OHASHI HIROMICHI
TOKUDA HITOMOTO
TANAKA YASUNORI
FUKUDA KENJI
AOYAGI MASAHIRO
OHASHI HIROMICHI
TOKUDA HITOMOTO
Application Number:
JP2008167759A
Publication Date:
January 14, 2010
Filing Date:
June 26, 2008
Export Citation:
Assignee:
NAT INST OF ADV IND & TECHNOL
SUMITOMO ELECTRIC INDUSTRIES
SUMITOMO ELECTRIC INDUSTRIES
International Classes:
H01L21/60
Domestic Patent References:
| JP2004260131A | 2004-09-16 | |||
| JP2001196420A | 2001-07-19 | |||
| JP2000340596A | 2000-12-08 |
Attorney, Agent or Firm:
Yoshiyuki Inaba
Shinji Oga
Toshifumi Onuki
Takahiro Kobuki
Shinji Oga
Toshifumi Onuki
Takahiro Kobuki
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