Title:
METHOD OF BONDING TWO RIGID SHEET HAVING COEFFICIENT OF THERMAL EXPANSION DIFFERENT FROM EACH OTHER TO EACH OTHER AND WARP DEFORMATION HOLDING DEVICE TO BE USED FOR THAT METHOD
Document Type and Number:
Japanese Patent JP3437609
Kind Code:
B2
Abstract:
PURPOSE: To reduce deformation of a laminated sheet curved outward toward a rigid sheet having the low coefficient of thermal expansion, by a method wherein the two rigid sheets whose coefficients of thermal expansion are different from each other are bonded together with an adhesive agent and heated while holding a warp deformation curved outward toward rigid sheet having the larger coefficient of thermal expansion.
CONSTITUTION: A glass epoxy resin material base 9 and synthetic resin material frame body sheet 10 having the coefficient of thermal expansion larger than that of the glass epoxy resin material base 9 are made into a laminated sheet 11 between block bodies 12, 13 by bonding them to each other through an adhesive agent. The laminated sheet 11 is inserted so that the base 9 and frame body sheet 10 abut respectively against a projected and bent surface 12a of a lower part block body and a recessed and bent surface 13a of an upper part block body and the laminated sheet 11 is placed between the block bodies 12, 13. Then the adhesive agent is solidified by heating the laminated sheet 11 at it is under this state. Hereby, it is possible to reduce the deformation of the laminated sheet curved outward toward the base 9 having the low coefficient of thermal expansion.
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Inventors:
Atsushi Imai
Application Number:
JP24138893A
Publication Date:
August 18, 2003
Filing Date:
September 28, 1993
Export Citation:
Assignee:
ROHM Co., Ltd.
International Classes:
B32B7/00; B32B18/00; B32B27/00; B32B27/08; B32B37/10; (IPC1-7): B32B31/20; B32B18/00; B32B27/00; B32B27/08
Domestic Patent References:
| JP63262241A | ||||
| JP6394841A | ||||
| JP56162653A | ||||
| JP4304930A |
Attorney, Agent or Firm:
Akio Ishii (2 outside)