PURPOSE: To enhance the high-accuracy hole position accuracy and the boring and working efficiency of the title method by a method wherein a displacement amount in the stacking and molding operation of an inner-layer core is confirmed by X-rays and a reference hole for boring use is bored.
CONSTITUTION: A reference hole 2 used from the formation of an inner-layer pattern up to a lamination operation is bored in copper-clad laminated boards 1a, 1b and an inner-layer pattern 5 is then formed on the inner-layer core 1a. After that, the copper-clad laminated boards 1a, 1b are stacked, a pin 6 for lamination use is inserted into the reference hole 2, this assembly is heated, pressurized for lamination, and a multilayer printed wiring board 1 is formed. The displacement amount of the inner-layer pattern 5 on the multilayer printed wiring board 1 which has been laminated is measured by X-rays 7, the average displacement amount Δx=(Δx1+Δx2)/2 of Δx1 and Δ2 is found, a reference hole 3 for boring use is bored in the multilayer printed wiring board 1 by correcting the average displacement amount Δx. After that, a pin 8 for boring use is inserted into the reference hole 3 for boring use, this assembly is fixed to a table at an NC boring machine, and a product inner hole 4 is bored.
IMAHASHI FUMIO
FUSE YOSHIAKI
