PURPOSE: To provide a method of electrical connection capable of low-resistance, narrow-pitch connections and easy correction of defectives.
CONSTITUTION: Connection terminals 6 of a flexible circuit 3 are subjected to flow soldering for two seconds so that they can be covered with low-melting metal 7 in a hemispheric shape by surface tension. The flexible circuit is positioned with its terminals 6 facing the electrode terminals 2 of a glass substrate 1. The low-melting metal on the terminals 6 is heated and soften rather than melted, and the flexible circuit is pressed against the glass substrate under a pressure of 50kg/cm2 by an anisotropic conductor film press. As a result, the terminals are electrically connected by the plastic deformation of the low- melting metal. Then, resin such as thermosetting epoxy or thermoplastic UV- curing acrylic is applied between the glass substrate and the flexible circuit and hardened.
TOSHIBA ELECTRONIC ENG