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Title:
METHOD OF CONNECTING ELECTRONIC CIRCUIT
Document Type and Number:
Japanese Patent JPH05145227
Kind Code:
A
Abstract:

PURPOSE: To provide a method of electrical connection capable of low-resistance, narrow-pitch connections and easy correction of defectives.

CONSTITUTION: Connection terminals 6 of a flexible circuit 3 are subjected to flow soldering for two seconds so that they can be covered with low-melting metal 7 in a hemispheric shape by surface tension. The flexible circuit is positioned with its terminals 6 facing the electrode terminals 2 of a glass substrate 1. The low-melting metal on the terminals 6 is heated and soften rather than melted, and the flexible circuit is pressed against the glass substrate under a pressure of 50kg/cm2 by an anisotropic conductor film press. As a result, the terminals are electrically connected by the plastic deformation of the low- melting metal. Then, resin such as thermosetting epoxy or thermoplastic UV- curing acrylic is applied between the glass substrate and the flexible circuit and hardened.


Inventors:
SASAKI TAKESHI
Application Number:
JP30607491A
Publication Date:
June 11, 1993
Filing Date:
November 21, 1991
Export Citation:
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Assignee:
TOSHIBA CORP
TOSHIBA ELECTRONIC ENG
International Classes:
H05K3/36; H05K3/32; (IPC1-7): H05K3/36
Attorney, Agent or Firm:
Kabazawa Xiang (3 outside)



 
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