PURPOSE: To provide a stable soldering method having high reliability even for a weak heat resistant component and an electronic component which cannot be cleaned.
CONSTITUTION: After connecting parts of a weak heat resistant component and a heat resistant component of a board are coated with cream solder, only the heat resistant component is mounted, reflow-soldered, spare solder solidified from cream solder is formed on the connecting parts of the low heat-resistant component, at least one of the weak heat resistant component and the spare solder is coated with flux, the low heat-resistant component is mounted on the connecting part of the weak heat-resistant component, and reflow-soldered. When an electronic component which cannot be cleaned and an electronic component which can be cleaned are electrically connected to a board, the board is coated with cream solder, only the component which can be cleaned is then mounted, batch-soldered, a spare solder is formed, the board is then cleaned, and at least one of the electrode of the component which can be cleaned and the spare solder is coated with flux, and soldered.
SATO SHOJI
YAMAUCHI MASARU
INUZUKA RYOJI
