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Title:
METHOD OF CONNECTING FLAT CIRCUIT BODIES WITH EACH OTHER, ELECTRIC CONNECTION BOX AND METHOD OF MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2004032877
Kind Code:
A
Abstract:

To provide the interlayer connection between compact and reliable flat circuit bodies.

The insulating layers of the flat circuit bodies 1-4 are removed by laser to expose the lead wires 6 and 6' of the flat circuit bodies, and the exposed lead wires of both flat circuit bodies are fused together in condition that several flat circuit bodies are stacked. A cut is made in the insulating layer by laser, and then the cut section is die-cut with a punch to expose the lead wires 6 and 6'. After exposure of the lead wires 6 and 6', at least one exposed lead wire is brought into contact or nearly touch with the other exposed lead wire. The mutual fusion of the exposed conductors is performed by low-resistance welding. A flat circuit assembly 37 is stored in a connection box body 36, and the terminal cable 31 of the flat circuit body assembly is pressure-welded to the press-welding part 41 of the terminal 42 on the side of the connection box body. The flat circuit body assembly 37 is set on an insulating plate 38.


Inventors:
KUBOTA KATSUHIRO
Application Number:
JP2002184264A
Publication Date:
January 29, 2004
Filing Date:
June 25, 2002
Export Citation:
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Assignee:
YAZAKI CORP
International Classes:
H01R43/00; H01R9/03; H02G1/14; H02G3/16; (IPC1-7): H02G3/16; H01R9/03; H01R43/00; H02G1/14
Attorney, Agent or Firm:
Hideo Takino
Hiroshi Ochi
Sadao Matsumura
Isamu Kakiuchi



 
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