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Title:
METHOD OF CONNECTING FLEXIBLE WIRING BOARD AND MANUFACTURE OF ELECTRO-OPTICAL DEVICE
Document Type and Number:
Japanese Patent JP2001094250
Kind Code:
A
Abstract:

To provide a method of connecting a flexible wiring board and a method of manufacturing an electro-optical device which facilitates connecting to a work at a high accuracy and simplifies module process steps.

The method of connecting a flexible wiring board to a work comprises step a) of detecting regions for connecting terminals (output terminal regions 235A) of the flexible wiring board 23 on wiring bond regions 26A of the work (liquid crystalline panel), step b) of placing positioning members 100 for positioning the output terminal regions 235A on the regions detected in step a) for bonding the output terminal regions 235A, step c) of setting the output terminal regions 235A at specified positions, using the positioning members 100, step d) of temporarily fixing the output terminal regions 235A positioned in step c) by pressure-welding an anisotropically conductive film, etc., and step e) of bonding the output terminal regions 235A to the wiring bond regions 26A after removing the positioning members 100.


Inventors:
ARIGA YASUHITO
Application Number:
JP27051499A
Publication Date:
April 06, 2001
Filing Date:
September 24, 1999
Export Citation:
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Assignee:
SEIKO EPSON CORP
International Classes:
G09F9/30; G02F1/1345; G09F9/00; H05K3/36; (IPC1-7): H05K3/36; G02F1/1345; G09F9/00
Attorney, Agent or Firm:
Hajime Inoue (2 outside)