PURPOSE: To connect a surface mount component to a board on which a conductive pattern is formed in a high density by temporarily fixing the component with viscosity of a flux film until the component is fixedly connected to the pattern, and then fixedly connecting the component to the pattern by utilizing a solder coating film.

CONSTITUTION: A conductive pattern 3 is coated with a solder coating film 4 for the purpose of rustproofing a conductive pattern 3. A flux film 5 is formed on the surface formed with the pattern 3 of a board 1, a surface mounting component 6 is brought into contact with the film 5 oppositely to the pattern 3 covered with the film 4, and temporarily fixed with viscosity of the film 5. In the step of reflowing, the film 4 is heated, melted, then cooled at the ambient temperature and solidified. Thus, the component 6 is connected to the pattern 3. Accordingly, the steps of printing cream solder and temporarily fastening the component 6 can be omitted.