To prevent the shaking of a stage during stepping motions.

While a substrate, such as the wafer, etc., to be exposed is held on a stage 1, stepping motions and scanning motions are alternately performed in accordance with commands given from a stage sequence controller 30. The controller 30 is composed of a position sensor 2, a motor 3, a target speed generator 7, etc., and controls the position of the stage 1 on a vibration- absorbing table 10. Though centroid correction is performed during scanning motions by feeding back the target moving distance, etc., of the stage 1 to the control systems of the air springs 12a and 12b of the table 10, the shaking of the stage 1 is prevented by enlarging the position control gain of the table 10 by means of a gain setter 31 during the stepping motions.