Title:
METHOD FOR CUTTING MATERIAL BY LASER BEAM
Document Type and Number:
Japanese Patent JP2001150170
Kind Code:
A
Abstract:
To provide a cutting method by which a think object can be cut even by a low output laser beam oscillator.
The cutting method comprises a first step for cutting a prescribed pitch P regarding a cutting direction by moving (1) a laser beam downward while irradiating the work 12 at an oblique angle from the oblique upside regarding the thickness direction of the work and a second step moving (2) the irradiation position of the laser beam upward after cutting the prescribed pitch P and moving (3) the laser beam in the cutting direction by the prescribed pitch P. The above first step and the above second step are repeated until the cutting is completed.
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Inventors:
KUROSAWA TAKASHI
YOSHIKAWA MITSUAKI
TANNO YASUO
YOSHIKAWA MITSUAKI
TANNO YASUO
Application Number:
JP33751899A
Publication Date:
June 05, 2001
Filing Date:
November 29, 1999
Export Citation:
Assignee:
SUMITOMO HEAVY INDUSTRIES
International Classes:
B23K26/40; B23K26/082; B23K26/38; E04G23/08; (IPC1-7): B23K26/00
Attorney, Agent or Firm:
Yosuke Goto (1 person outside)
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