PURPOSE: To enhance the reliability of bonding by respectively applying weak voltage to a wire before the bonding of the wire, after the first bonding thereof and after the second bonding thereof to detect abnormality.
CONSTITUTION: A lead frame 2 having a pellet 1 fixed thereto is positioned on a sample table 3. The first bonding abnormality detection 23 same to conventional one is performed during period after the first bonding but before the second bonding and, subsequently, the second bonding abnormality detection 24 is performed during the period after the second bonding but before wire cutting 22 and wire abnormality detection 25 before wire bonding is performed. The second bonding abnormality detection 24 is performed by raising a capillary 7 after the completion of the second bonding and connecting a switch 10 to a normally opened contact 10C before wire cutting 22. That is, a DC current 14 or 15 is applied to the wire 4 and said wire 4 is checked on the basis of the output of a detector 11.
MOCHIDA TORU
YAMAZAKI NOBUHITO
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