To uniformly apply a passivation material to a whole bevel without a void regardless of the bevel's shape by providing a passivation material supply nozzle for supplying the passivation material to a roller and an intra-roller cleaning device for removing the passivation material in the roller.
Polyimide as the passivation material, for example, is supplied from the passivation material supply nozzle 6 to the roller 5. At the same time, the roller 5 starts horizontal shift toward a semiconductor substrate 1 while it rotates. Then, the roller 5 stops horizontal shift in a position where the semiconductor substrate 1 is inserted into the groove part of the roller with non- contact. Then, polyimide is applied to the outer peripheral part of the semiconductor substrate 1 and to the bevel surface. At that time, it is necessary to apply polyimide to the outer peripheral surface of the semiconductor substrate 1 and to the bevel surface with a uniform coating thickness as designed. Polyimide remaining in the roller 5 immediately after coating is removed by an intra- roller cleaning device 7 at all times.
YAMAGUCHI YOSHIO
KINOSHITA TOMOO
SAISU KOICHI
