Title:
METHOD AND DEVICE FOR COMPONENT MOUNTING
Document Type and Number:
Japanese Patent JP3523972
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a component mounting method and device which mount a component at a precise montage angle.
SOLUTION: A controller 2 is provided to rotate a nozzle from its basic position in a direction I or II at a mounting angle θ, prior to mounting a component to a circuit substrate, and finally rotate the nozzle in the direction II to return to the basic position to mount the component to the circuit substrate. As the nozzle is rotated in the direction II not to cause rotation error immediately before the component is mounted, the component can be mounted at the precise mounting angle.
Inventors:
Yoshida, Noriaki
Takeda, Takeshi
Kabeshita, Akira
Takeda, Takeshi
Kabeshita, Akira
Application Number:
JP34759396A
Publication Date:
April 26, 2004
Filing Date:
December 26, 1996
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
B23P21/00; H05K13/04; (IPC1-7): H05K13/04
Attorney, Agent or Firm:
青山 葆 （外２名）
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