Title:
METHOD AND DEVICE FOR ELECTRIC TRANSMISSION LINE INTERFACE
Document Type and Number:
Japanese Patent JPH05204490
Kind Code:
A
Abstract:
PURPOSE: To provide one or plural transmission lien interfaces to a multi-chip module or a heat conduction module.
CONSTITUTION: A driver or a reception circuit for interface to an electric transmission line is provided on a substrate 40 having a semiconductor chip 50. An integrated type means which positions the electric transmission line and supports it and passes it in a shielded environment is provided. Fluid sealing seals for various components in a housing can be provided. A variable time delay means 71 is provided for another application example of a microwave or a computer clock system.
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Inventors:
ROORENSU JIYAKOBOBUITSUTSU
MARIO ENRIKE ETSUKAA
MARIO ENRIKE ETSUKAA
Application Number:
JP5281192A
Publication Date:
August 13, 1993
Filing Date:
March 11, 1992
Export Citation:
Assignee:
IBM
International Classes:
H01P1/04; G06F1/18; (IPC1-7): G06F1/18
Domestic Patent References:
| JPS6339205A | 1988-02-19 |
Attorney, Agent or Firm:
Koichi Tonmiya (4 outside)
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