Title:
METHOD AND DEVICE FOR FOREIGN MATTER INSPECTION
Document Type and Number:
Japanese Patent JP3938227
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a wafer foreign matter inspecting technology which can specifies the size and shape of a foreign body.
SOLUTION: The foreign matter inspecting device 10 which lights up a wafer 1 obliquely by an inspection light irradiating device 20 and detects scattered light 31 of inspection light 21 on the wafer 1 in a dark visual field by a scattered light detector 34 to specify the coordinate position of a foreign matter 5 is provided with a down lighting device 40 and an image pickup device 45. The coordinate position of the foreign matter 5 specified by a foreign body decision device 35 through the detection of the scattered light detector 34 is picked up by the image pickup device 45 in the presence of light field lighting by the down lighting device 40 and a foreign matter image is extracted through this image pickup operation. The size, shape, color, and properties of the foreign matter are specified by using the extracted foreign matter image. Consequently, the size, shape, color, and properties of the foreign matter can be specified only by the foreign matter inspecting device, so the foreign matter can accurately and speedily be reviewed at low cost.
Inventors:
Junichi Taguchi
Yumi Sugimoto
Masami Ikoda
Yuko Inoue
Tetsuya Watanabe
Yumi Sugimoto
Masami Ikoda
Yuko Inoue
Tetsuya Watanabe
Application Number:
JP22583697A
Publication Date:
June 27, 2007
Filing Date:
August 07, 1997
Export Citation:
Assignee:
Renesas Technology Corp.
Hitachi High-Technologies Corporation
Hitachi High-Technologies Corporation
International Classes:
G01B11/24; G01B11/245; G01N21/88; G01N21/94; G01N21/956; H01L21/66; (IPC1-7): G01B11/24; G01N21/88; H01L21/66
Domestic Patent References:
| JP1191046A | ||||
| JP7325041A | ||||
| JP62173731A | ||||
| JP8029354A | ||||
| JP2115752A | ||||
| JP4343047A |
Attorney, Agent or Firm:
Kajiwara Tatsuya