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Title:
METHOD AND DEVICE FOR MANUFACTURE OF SPLIT PIECE LAMINATED WOOD
Document Type and Number:
Japanese Patent JPH07195313
Kind Code:
A
Abstract:

PURPOSE: To utilize all of chips and construction scraps without wasting them by a method wherein raw materials such as wood and bamboo are split in the longitudinal direction, thin split materials obtained by splitting the raw materials thinly furthermore are dried, the thin split materials coated with an adhesive are aligned in the longitudinal direction so as to form single-layers, the single-layers are laminated in a plurality of layers, and they are heated and clamped with pressure.

CONSTITUTION: A cut log A is split by a splitting device 5 so as to form split pieces 6. The split pieces 6 sent to a thinly splitting device 7 are split furthermore thinly so as to produce thin split pieces 8. The thin split pieces 8 are dried with hot air in a drying device 9. Thereafter, the thin split pieces 8 are sent to an adhesive coating device 17 so as to be coated with the adhesive. The thin split pieces 8 are sent to a laminating means 18. While they are being aligned on a belt conveyor of a conveying means 20, single-layers of the thin split pieces 8 are laminated in sequence split piece mat 12 is adjusted to a predetermined length by a cutting device 21, it is sent to a press-clamp means 22 so as to be heated and clamped with pressure.


Inventors:
FUJII TAKESHI
MIYATAKE ATSUSHI
Application Number:
JP35227193A
Publication Date:
August 01, 1995
Filing Date:
December 28, 1993
Export Citation:
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Assignee:
RINYACHIYOU SHINRIN SOGO KENKY
International Classes:
B27L11/08; B27M3/00; B27N3/00; (IPC1-7): B27M3/00; B27L11/08
Domestic Patent References:
JPS52154876A1977-12-22
JPH02111503A1990-04-24
JPS632762A1988-01-07
JPS5222472U1977-02-17
JPH0671612A1994-03-15
JPH0751285A1995-02-28
JP3047102U1998-03-31
JPS62218105A1987-09-25
JPS6268702A1987-03-28
JPS6121811A1986-01-30
JPS5352497U1978-05-04
JPS5541885A1980-03-24
JPS4993096U1974-08-12
Attorney, Agent or Firm:
Koichi Ouchi