To provide a method and a device for manufacturing a copper wire with which the generation of surface flaws and the occurrence of break in the copper wire.

In this method for manufacturing the copper wire, when manufacturing the copper drawn wire having a desired diameter by continuously performing cold drawing by threading the copper wire 102 through a wire drawing die 104, sucking parts 105, 106 are provided facing to the drawing part of the copper wire 102 of the wire drawing die 104 and the copper wire 102 is drawn while sucking and removing the foreign matter stuck to the surface of the copper wire 102 to be drawn or copper chips which are produced when drawing the wire from the sucking part 105, 106.