Title:
METHOD AND DEVICE FOR MANUFACTURING IC CARD USED IN COMMON AS CONTACT AND NON-CONTACT TYPES
Document Type and Number:
Japanese Patent JP2001331775
Kind Code:
A
Abstract:
To improve the quality of a product and to remarkably improve the yield of manufacture by preventing the deformation of a card base material (defective appearance or outside of a standard size) caused by heat at a low cost.
The manufacturing device 10 for the IC card is provided with a stage 11, a positioning pin 12 for positioning a card base material 21 on the stage 11, a heat radiation panel 13 provided with a window 13a, a presser 14 for pressing the panel 13, a heater chip 15 for heating an IC module 30 and a presser 16, etc., for pressing the chip 15.
Inventors:
YAMADA SHUICHI
Application Number:
JP2000149493A
Publication Date:
November 30, 2001
Filing Date:
May 22, 2000
Export Citation:
Assignee:
DAINIPPON PRINTING CO LTD
International Classes:
B42D15/10; G06K19/07; G06K19/077; (IPC1-7): G06K19/077; B42D15/10; G06K19/07
Domestic Patent References:
| JPS6490797A | 1989-04-07 | |||
| JPS61227094A | 1986-10-09 | |||
| JPH11510626A | 1999-09-14 | |||
| JPH01225531A | 1989-09-08 |
Attorney, Agent or Firm:
Hisao Kamata