To provide a method for manufacturing a non-contact type IC card capable of manufacturing a non-contact IC module, which has excellent appearance performance such as satisfactory smoothness of a surface, etc., without the occurrence of remarkable waving and tilting or the deviation, etc., of an IC module, with high productivity.
The method for manufacturing the non-contact type IC card which arranges a hot melt adhesive on both of the upper and lower surfaces of the IC module to mount it on a board, laminates a decoration film on the other exposed surface of the hot melt adhesive and embeds the IC module in the hot melt adhesive by using a press forming device to adhere it to a base material and the decoration film. In the case of press forming, on the outer periphery of the laminated body of the base material, the IC module, the hot melt adhesive and the decoration film, a frame having a thickness within obtained (the thickness of the non-contact type IC card) ±20% is interposed between press die plates.
MIYAKE TAKESHI
HASEGAWA TAKESHI
SHINJO TAKASHI
