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Title:
METHOD AND DEVICE FOR MONITORING GRINDING ABNORMALITY
Document Type and Number:
Japanese Patent JP2013129027
Kind Code:
A
Abstract:

To provide a method and device for monitoring a grinding abnormality capable of improving determination accuracy of grinding burn generated in grinding of a workpiece.

A threshold of grinding load of a grinding wheel 43 is set in relation to rotating speed of a workpiece W when the grinding burn of the workpiece W is generated on the basis of a relationship between the rotating speed of the workpiece W when grinding the workpiece W and the grinding load of the grinding wheel 43. When grinding the workpiece W, the grinding load of the grinding wheel 43 and the rotating speed of the workpiece W are detected. Accordingly, grinding burn of the workpiece W generated by heating due to large grinding load applied instantaneously and grinding burn of the workpiece W generated by heat conduction due to contact between the workpiece W and abrasive grain and chip over many hours can be monitored, thereby enabling improvement of determination accuracy of grinding burn generated in grinding of the workpiece W.


Inventors:
KASUGA SATOYUKI
SAITO ATSUSHI
YOSHIMI TAKAYUKI
Application Number:
JP2011280848A
Publication Date:
July 04, 2013
Filing Date:
December 22, 2011
Export Citation:
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Assignee:
JTEKT CORP
International Classes:
B24B49/16; B24B49/10; B24B49/14
Domestic Patent References:
JPH08257888A1996-10-08
JPS6362676A1988-03-18
JPH0929630A1997-02-04
JPS637267A1988-01-13
JP2009083049A2009-04-23
Attorney, Agent or Firm:
Kobayashi Osamu
Kiichi Yamamoto