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Title:
SAW WIRE
Document Type and Number:
Japanese Patent JP2013129026
Kind Code:
A
Abstract:

To provide a saw wire which has satisfactory wear resistance, allows quality of a cut out wafer to be kept satisfactory and furthermore has little risk of wire breaking in use.

In a saw wire 1, brass plating 3 is applied to a surface of a saw wire body 2. The saw wire body 2 has a wire diameter of 0.04 to 0.14 mm and has a Martens hardness of 6,500 N/mm2 or more in a position at a depth of 8% of a radius from the surface. If a Martens hardness in a position at a depth of 8% of a radius from the surface is 6,500 N/mm2 or more, a wear amount of the saw wire body 2 is not increased as compared with a conventional one. Further, if a diameter of the saw wire body 2 is in a range of 0.04 to 0.14 mm, wire breaking of the saw wire body 2 is not generated upon cutting of an ingot and a thickness of a wafer cut out from the ingot using the saw wire body 2 becomes uniform.


Inventors:
SHIOYA TOMOKI
Application Number:
JP2011280696A
Publication Date:
July 04, 2013
Filing Date:
December 22, 2011
Export Citation:
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Assignee:
TOKYO SEIKO CO LTD
International Classes:
B24B27/06; H01L21/304
Domestic Patent References:
JP2001287146A2001-10-16
JP2003056848A2003-02-26
JP2005193332A2005-07-21
JP2011005624A2011-01-13
JP2000233356A2000-08-29
JP2000271807A2000-10-03
JP2001327636A2001-11-27
JP2001287146A2001-10-16
JP2003056848A2003-02-26
JP2005193332A2005-07-21
JP2011005624A2011-01-13
Other References:
JPN6015005748; 倉本　英哲、伊藤　良子、隠岐　貴史: '（１）鉄鋼材料の超微小硬さ試験' 広島市工業技術センター年報 第２６巻, 2012, 第３１-３８頁　第１２式, 広島市工業技術センター
Attorney, Agent or Firm:
Kenji Ushiku
Tadashi Inoue
Takaaki Teiaki



 
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