Title:
METHOD AND DEVICE FOR MOUNTING ELECTRONIC PARTS
Document Type and Number:
Japanese Patent JP3480293
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method and device for electronic parts mounting which inexpensively cope with reduction of the mounting space of electronic parts.
SOLUTION: An end face 12A of an upper glass substrate 12 is brought into contact with a positioning member 5 to position a liquid crystal panel 10. Therefore, a press-fixing head 4 and the glass substrate 12 are prevented from coming too close to each other to prevent the mutual interference independently of dimension errors of glass substrates 11 and 12 if only positioning of the positioning member 5 and the press-fixing head 4 is accurate. Consequently, gap dimensions G between the glass substrate 12 and a liquid crystal driver IC 20 are made smaller to make the liquid crystal panel 10 small-sized, and further, the liquid crystal driver IC 20 is surely press-fixed. Optical means are made unnecessary to make a mounting device 1 inexpensive.
Inventors:
Eiji Muramatsu
Application Number:
JP1623498A
Publication Date:
December 15, 2003
Filing Date:
January 28, 1998
Export Citation:
Assignee:
Seiko Epson Corporation
International Classes:
G02F1/1345; G09F9/00; H01L21/603; H05K3/32; (IPC1-7): G09F9/00; G02F1/1345; H01L21/603; H05K3/32
Domestic Patent References:
| JP9297318A | ||||
| JP8248431A | ||||
| JP9127536A | ||||
| JP61107322A |
Attorney, Agent or Firm:
Masanori Ueyanagi (1 outside)
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