Title:
METHOD AND DEVICE FOR SPLITTING SUBSTRATE, AND METHOD FOR MANUFACTURING LIQUID CRYSTAL PANEL
Document Type and Number:
Japanese Patent JP3925092
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method and a device for splitting a substrate capable of previously preventing from occurring a trouble of a laser oscillator by preventing generation of interference of laser light irradiating a surface and a rear face of the substrate, respectively.
SOLUTION: The method and device for splitting the substrate, wherein both sides of a panel 15 composed of 2 substrates stuck together are irradiated with laser light L1, and L2 simultaneously are characterized in that at least either of laser light between L1, and L2 irradiating each substrate, is made incident to substrate so as to keep a prescribed angle θ to a perpendicular line 7 which is orthogonal to the surface of the substrate.
Inventors:
Kenji Masuda
Application Number:
JP2001059049A
Publication Date:
June 06, 2007
Filing Date:
March 02, 2001
Export Citation:
Assignee:
Seiko Epson Corporation
International Classes:
C03B33/09; G02F1/13; B23K26/042; B23K26/082; B23K26/364; B23K26/38; B23K26/40; C03B33/023; C03B33/07; G02F1/1333; B23K101/36; (IPC1-7): C03B33/09; B23K26/00; B23K26/04; B23K26/08; C03B33/023; G02F1/13; G02F1/1333; //B23K101:36
Domestic Patent References:
| JP11160667A | ||||
| JP2001212683A | ||||
| JP2001042302A |
Attorney, Agent or Firm:
Masahiko Ueyanagi
Osamu Suzawa
Osamu Suzawa
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