METHOD AND DEVICE FOR SUPER PRECISE CENTERLESS GRINDING

Title:

METHOD AND DEVICE FOR SUPER PRECISE CENTERLESS GRINDING

Document Type and Number:

Japanese Patent JP2004114179

Kind Code:

A

Abstract:

To efficiently perform centerless grinding finishing for a plurality of tapered surfaces having different tapered angles with super high precision of less than 0.1 microns at a low cost.

A preliminary finishing part P and a super high precision finishing part F constituted of two pairs of centerless grinding mechanisms having the same shape and dimension are installed in parallel on a common bed B. A workpiece (not illustrated because the workpiece is very small in a scale of this figure) is preliminarily finished with high precision (micron order) by the preliminary finishing part P. The centerless grinding finishing is performed for a tapered part with super high precision by the super high precision finishing part F.

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Inventors:

SAKAE MOHEE
SHIKAMA SHIGEMI
TAKAHASHI MASAYUKI

Application Number:

JP2002277785A

Publication Date:

April 15, 2004

Filing Date:

September 24, 2002

Export Citation:

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Assignee:

MICRON MACHINERY

International Classes:

B23Q11/10; B24B5/24; B24B53/053; B24B55/02; (IPC1-7): B24B5/24; B23Q11/10; B24B53/053; B24B55/02

Attorney, Agent or Firm:

Patent business corporation Protech

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