Title:
METHOD FOR DRYING SUBSTRATE
Document Type and Number:
Japanese Patent JP2004228203
Kind Code:
A
Abstract:
To provide a method for drying a substrate that can prevent the occurrence of a water mark and has satisfactory throughput even in the substrate having a surface, where the strength of hydrophilic properties is different.
In a substrate treating method for removing a liquid DIW adhering onto the surface of a substrate W, the surface of the substrate W has portions 10, 11 where the strength of hydrophilic properties is different each other. Rotating the substrate W removes the liquid DIW from the portion 10 whose hydrophilic properties are weak. Increasing a rotational speed for rotating the substrate W removes the liquid DIW from the portion 11 whose hydrophilic properties are strong.
Inventors:
ONO HIROKI
Application Number:
JP2003012098A
Publication Date:
August 12, 2004
Filing Date:
January 21, 2003
Export Citation:
Assignee:
TOKYO ELECTRON LTD
International Classes:
F26B5/08; F26B25/00; H01L21/304; (IPC1-7): H01L21/304; F26B5/08; F26B25/00
Attorney, Agent or Firm:
Koji Hagiwara
Tetsuo Kanamoto
Miaki Kametani
Tetsuo Kanamoto
Miaki Kametani
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