SPIN TREATMENT METHOD OF SUBSTRATE AND TREATING APPARATUS

Title:

SPIN TREATMENT METHOD OF SUBSTRATE AND TREATING APPARATUS

Document Type and Number:

Japanese Patent JP2004228205

Kind Code:

A

Abstract:

To provide a spin treatment method capable of preventing particles from adhering to equipment when treating a semiconductor wafer by a treatment liquid before drying and treatment.

The spin treatment method for treating the semiconductor wafer by the treatment liquid before drying and treatment includes a process for supplying the treatment liquid for treatment while the semiconductor is being rotated; a process for stopping the supply of the treatment liquid and rotating the semiconductor wafer for specific time without increasing the speed of the semiconductor wafer after the semiconductor wafer is completely treated by the treatment liquid; and a process for stopping the supply of the treatment liquid for rotating the semiconductor wafer for the specific time, before the rotational speed of the semiconductor wafer is set faster than that in the treatment by the treatment liquid for drying and treating.

Inventors:

KIKUCHI TSUTOMU

Application Number:

JP2003012167A

Publication Date:

August 12, 2004

Filing Date:

January 21, 2003

Export Citation:

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Assignee:

SHIBAURA MECHATRONICS CORP

International Classes:

F26B5/08; F26B11/08; H01L21/304; (IPC1-7): H01L21/304; F26B5/08; F26B11/08

Attorney, Agent or Firm:

Takehiko Suzue
Satoshi Kono
Makoto Nakamura
Kurata Masatoshi
Sadao Muramatsu
Ryo Hashimoto

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