METHOD FOR ENCAPSULATING ELECTRONIC ARRANGEMENT

Title:

METHOD FOR ENCAPSULATING ELECTRONIC ARRANGEMENT

Document Type and Number:

Japanese Patent JP2010144169

Kind Code:

A

Abstract:

To provide a method for encapsulating an electronic arrangement against permeants, in particular steam and oxygen, which is simply conducted and simultaneously which achieves excellent encapsulation.

The method for encapsulating the electronic, preferably optoelectronic, arrangement against the permeants, in which a pressure-sensitive adhesive based on a partly crystalline polyolefin is applied onto and/or around the regions of the electronic arrangement which are to be encapsulated, wherein the polyolefin has density between 0.86 and 0.89 g/cm3and a crystallite melting point of 90°C at the lowest.

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Inventors:

ELLINGER JAN
KLAUS KEITE-TELGENBUESCHER
MUESSIG BERNHARD
METZLER KERSTIN

Application Number:

JP2009284383A

Publication Date:

July 01, 2010

Filing Date:

December 15, 2009

Export Citation:

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Assignee:

TESA SE

International Classes:

C09J7/00; C09J11/00; C09J123/00

Attorney, Agent or Firm:

Mitsufumi Esaki
Okumura Yoshimichi
Blacksmith
Katsunori Uenishi
Ichiro Torayama

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