To provide a method for treating PCB waste, which can eliminate the need for using an excessively large plasma melting decomposition furnace regardless of the sizes of PCB waste and storage containers used for storing the PCB waste, and which can perform detoxification treatment thereof using a plasma melting decomposition furnace having an appropriate size.
The method for treating PCB waste includes: a repacking step of repacking PCB waste 11 stored in a storage container 12 into an enclosing container 17 or an enclosing resin bag 18 having such a size as to be able to be supplied into a plasma melting decomposition furnace; and a melting decomposition treatment step of supplying small repacked PCB waste 19, which has been repacked into the enclosing container 17 or the enclosing resin bag 18, into the plasma melting decomposition furnace, and thereby decomposing PCB.
HASEGAWA HIDEKI
TANAKA KUNIHIKO
HIROISHI AKIHISA
| JP2008202804A | 2008-09-04 | |||
| JP2007244958A | 2007-09-27 | |||
| JP2007296415A | 2007-11-15 | |||
| JP2008200543A | 2008-09-04 | |||
| JP2010179239A | 2010-08-19 | |||
| JP2009006301A | 2009-01-15 | |||
| JPH07291203A | 1995-11-07 |