Title:
METHOD FOR FORMING EXTERNAL ELECTRODE OF CHIP ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP3744505
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To solve the problem that the production efficiency is low and the process is intricate because a work for holding electronic components individually is required when an external electrode is formed on a chip electronic component.
SOLUTION: After the second major surface of a semiconductor wafer is bonded through adhesive, each individual electronic component is diced and the first major surface is coated with conductive paste to form an external electrode. On the other hand, the first major surface of the semiconductor wafer is bonded through adhesive and the second major surface is coated with conductive paste. According to the method, a large number of external electrodes of a chip electronic component can be formed at once.
Inventors:
Natsuki Tsuneda
Application Number:
JP2003103978A
Publication Date:
February 15, 2006
Filing Date:
April 08, 2003
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H01L21/60; H01L23/12; (IPC1-7): H01L21/60; H01L23/12
Domestic Patent References:
| JP2000252235A | ||||
| JP2002252308A | ||||
| JP5047841A | ||||
| JP2000031185A | ||||
| JP8046344A |
Attorney, Agent or Firm:
Fumio Iwahashi
Hiroki Naito
Daisuke Nagano
Hiroki Naito
Daisuke Nagano