METHOD OF FORMING PILLER TYPE GRID ARRAY PACKAGE

Title:

METHOD OF FORMING PILLER TYPE GRID ARRAY PACKAGE

Document Type and Number:

Japanese Patent JPH09213830

Kind Code:

A

Abstract:

PROBLEM TO BE SOLVED: To provide a method of manufacturing a solder piller and a solder piller package which can be automized easily without requiring customized jig material. SOLUTION: A flux 2 is added to a grid array package 10, and the solder balls 4 of the first set are adhered to the grid package 10 in such a manner that at least some space is present between the solder balls of the first set. The solder balls 14 of the first set are flattened. Epoxy resin 18 is put in the space between the solder balls of the first set, and the epoxy resin is cured. Flux 20 is added to the solder balls 14 of the first set, the solder balls 22 of the second set are bonded, and a solder piller is formed. An alignment fixing means 24 is used sometimes.

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Inventors:

SUNIRU EI PATERU
PATORITSUKU II OBURAIEN
RAMASUWAMII RANGANASAN

Application Number:

JP1237197A

Publication Date:

August 15, 1997

Filing Date:

January 27, 1997

Export Citation:

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Assignee:

LSI LOGIC CORP

International Classes:

H01L23/12; H01L21/60; H01L21/321; (IPC1-7): H01L23/12

Attorney, Agent or Firm:

Kyozo Yuasa (6 people outside)

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