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Title:
貫通孔形成方法及び貫通孔を有するガラス基板の製造方法
Document Type and Number:
Japanese Patent JP7020099
Kind Code:
B2
Abstract:
To obtain a desired open diameter and thickness of a glass substrate while making handling easy by suppressing generation of micro cracks when forming an open hole in the glass substrate.SOLUTION: An open hole formation method for forming an open hole 110 in a glass substrate 100, has a first process for etching the glass substrate 100 with an etching liquid, a second process for irradiating an open hole formation site of the glass substrate 100 with a laser to form a modification part G from a front side to a back side of the glass substrate 100, and a third process for etching the glass substrate having the modification part with the etching liquid to remove the modification part G and form the open hole 110.SELECTED DRAWING: Figure 2C

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Inventors:
Masaru Sawada
Application Number:
JP2017242528A
Publication Date:
February 16, 2022
Filing Date:
December 19, 2017
Export Citation:
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Assignee:
Toppan Printing Co., Ltd.
International Classes:
C03C23/00; B23K26/382; C03B33/023; C03B33/04; C03B33/09; C03C15/00
Domestic Patent References:
JP2017061401A
JP2016215245A
JP201389675A
Foreign References:
WO2017038075A1
WO2016129254A1
Attorney, Agent or Firm:
Masatoshi Kurata
Nobuhisa Nogawa
Naoki Kono
Tadashi Inoue
Ken Ukai



 
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