Title:
METHOD FOR GRINDING BENT PLATE-LIKE WORKPIECE
Document Type and Number:
Japanese Patent JP2022161165
Kind Code:
A
Abstract:
To reduce grindstone replacing work and eliminate necessity of stockpiling a plurality of types of grindstones when bent plate-like workpiece is ground by reducing force for separating the bent plate like workpiece from a holding surface.SOLUTION: A plate-like workpiece grinding method comprises steps of: holding bent plate-like workpiece having force in a direction in which an outer peripheral part is separated from a holding surface 302 on the holding surface 302 of a table 3, lowering a grindstone 1642 positioned above the plate-like workpiece in a direction perpendicular to the holding surface 302, and biting the grindstone 1642 into the plate-like workpiece to form a circular-arc groove without rotating the holding surface 302; relatively moving at least one of the grindstone 1642 and the table 3 so as to position the grindstone 1642 to a location different from the location of the grindstone 1642 positioned with respect to the plate-like workpiece in the circular-arc groove forming step; repeating the circular-arc groove forming step and the grindstone moving step to form a plurality of grooves on the upper surface of the plate-like workpiece, thereby correcting the bending; and grinding, after the grooves have been formed, the upper surface of the plate-like workpiece to remove the grooves, and grinding the workpiece to a prescribed thickness.SELECTED DRAWING: Figure 1
Inventors:
MANNAMI HIDETOSHI
MIYAMOTO HIROKI
MIYAMOTO HIROKI
Application Number:
JP2021065764A
Publication Date:
October 21, 2022
Filing Date:
April 08, 2021
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
B24B7/04; B24B19/02; B24B41/06; H01L21/304
Attorney, Agent or Firm:
Patent Attorney Corporation Tokyo Alpa Patent Office