To provide a method for grinding a wafer having a circular recessed portion of a predetermined depth and an annular projecting portion enclosing the circular recessed portion.

The method for grinding a wafer which wheel-grinds a central portion of a wafer rear surface to a first thickness to form a circular recessed portion having the first thickness and an annular projecting portion enclosing the circular recessed portion includes: a first grinding step of grinding an outer circumferential edge region of the wafer including at least the region of the wafer rear surface of the annular projecting portion with a grinding wheel having a diameter substantially half the diameter of the wafer to a second thickness greater than the first thickness by a predetermined value; and a second grinding step of grinding, after the first grinding step, the central portion of the wafer rear surface other than the region of the annular projecting portion with the grinding wheel to the first thickness to form on a bottom region the circular recessed portion having the first thickness and the annular projecting portion of the second thickness enclosing the circular recessed portion.