Title:
METHOD FOR HAVING THIN MATERIAL MOUNTED ON AND DISMOUNTED FROM PUNCH DEVICE, AND PUNCH DEVICE
Document Type and Number:
Japanese Patent JP3619135
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a mounting and dismounting method for a thin material that can efficiently mount and position a sheet of thin material on the table of a punch device and easily and reliably take out the thin material from the table after punching, and a punch device.
SOLUTION: The method lifts up the top faces of vertically movable lifters in advance from a table, feeds a thin material to the table so that at least an edge of the thin material covers the lifted lifter top faces to temporarily position the thin material whose reference portion is associated with a given position of the table, and lowers the lifters to mount and position the thin material on the table via the reference portion, and after the thin material is punched, lifts the lifters again to hold the lifted thin material edge and remove the thin material from the device. The device is so constructed that the table on which the thin material is mounted has a plurality of projecting reference pins for stopping the reference portion of the thin material, one or more puncher heads and a plurality of vertically movable lifters.
Inventors:
Inaba Kazuo
Application Number:
JP2000270266A
Publication Date:
February 09, 2005
Filing Date:
September 06, 2000
Export Citation:
Assignee:
Inaba Kazuo
International Classes:
B26D7/01; B26F1/00; (IPC1-7): B26F1/00; B26D7/01
Domestic Patent References:
| JP63074845A | ||||
| JP5056398U | ||||
| JP3093097U |
Attorney, Agent or Firm:
Kosaku Sugimura
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