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Title:
METHOD FOR INSPECTING CONNECTION STATE OF POWER SUPPLY DEVICE AND POWER SUPPLY DEVICE USING THE METHOD
Document Type and Number:
Japanese Patent JPH08271565
Kind Code:
A
Abstract:

To inspect the connection of a device externally by providing a resistance element between contact pads, setting a final power supply stage where power is supplied from the first contact pad to be in continuity, and comparing the measurement potential difference between the connection pins of each contact pad with a normal potential difference.

A first final power supply stage 3 is set to a reinforced continuity state by allowing a image current 11 which is approximately 4-5A to flow via a contact pin 8 of a power supply. Therefore, a small current, namely approximately 50mA, flows to the second final power supply stage 4 via an integrated resistance element 14. Current flowing in a power supply connection wire 7 of a double-wire connection by a supply power generating device is equal to the sun of two current 11 and 12 by the stages 3 and 4 and the intently early approaches the current 11. The potential difference between the contact pins 8 and 9 of the stages 3 and 4 becomes equal to the sum of a voltage drop via two wires 12 and the element 14 of the connection wire 7. Therefore, a value which is measured in advance fusing a sample product is compared with the measurement voltage value of a product, thus distinguishing the double-wire connection from a faulty single-wire connection.


Inventors:
DABIDE BURAMUBITSURA
JIYOBANNI KAPODEIBATSUKA
FUABURITSUIO SUTEFUANI
Application Number:
JP33672795A
Publication Date:
October 18, 1996
Filing Date:
December 25, 1995
Export Citation:
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Assignee:
SGS THOMSON MICROELECTRONICS
International Classes:
G01R31/02; G01R31/28; (IPC1-7): G01R31/02
Attorney, Agent or Firm:
酒井 宏明