Title:
METHOD FOR INSPECTING PELLET ON SEMICONDUCTOR WAFER
Document Type and Number:
Japanese Patent JP3261723
Kind Code:
B2
Abstract:
PURPOSE: To obtain a method by which the breakage of a bonding pad in a pellet 4 caused by an unnecessary pressure applied to the pad can be prevented at the setting-up time at the time of performing 100% inspection on pellet products on a wafer and a pad which is not brought into contact with a probe can be recognized without misjudgment when the probe falls apart from the pad for some reason in the course of the 100% inspection.
CONSTITUTION: The position of a pellet is recognized by using aluminum pads 7 provided on scribed lines of a semiconductor wafer 10, a card 5 which is divided into parts from its center by means of an insulator and equipped with probe 6, and a probe card 2 the height of which can be fixed in accordance with the card 5 and aligning the probe with the pads 7.
Inventors:
Katsunori Hirai
Application Number:
JP4080592A
Publication Date:
March 04, 2002
Filing Date:
February 27, 1992
Export Citation:
Assignee:
Kansai NEC Corporation
International Classes:
B25J19/02; G01R3/00; G01R31/26; (IPC1-7): G01R31/26
Domestic Patent References:
| JP5688333A | ||||
| JP5345181A | ||||
| JP28037U |
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