Title:
METHOD FOR MANUFACTURING ALUMINUM MEMBER WITH LAYER OF SOLDERING MATERIAL AND METHOD FOR MANUFACTURING HEAT EXCHANGER
Document Type and Number:
Japanese Patent JP2010132986
Kind Code:
A
Abstract:
To provide a means for forming a layer of a soldering material on the surface of an aluminum member, which can uniformly and accurately control the thickness of the layer of the soldering material without employing water and an organic solvent that obstruct soldering, and can extremely thin the layer of the soldering material.
The manufacturing method includes spraying Si particles having the average particle diameter of 0.3-25 μm onto the surface of a member made from aluminum (containing an alloy thereof) at a particle speed of 200 m/second or more with a cold spray method to form the layer of the soldering material having an Si-particle deposition amount of 0.4-12 g/m
COPYRIGHT: (C)2010,JPO&INPIT
Inventors:
SAKAKI KAZUHIKO
IWAI ICHIRO
MINAMI KAZUHIKO
IKAWA SHUNSUKE
IWAI ICHIRO
MINAMI KAZUHIKO
IKAWA SHUNSUKE
Application Number:
JP2008311244A
Publication Date:
June 17, 2010
Filing Date:
December 05, 2008
Export Citation:
Assignee:
UNIV SHINSHU
SHOWA DENKO KK
SHOWA DENKO KK
International Classes:
C23C24/04; B23K35/22; B23K35/40; F28F1/30
Domestic Patent References:
| JP2009291793A | 2009-12-17 | |||
| JP2008115467A | 2008-05-22 | |||
| JPH11291028A | 1999-10-26 | |||
| JP2007191780A | 2007-08-02 | |||
| JP2006145060A | 2006-06-08 | |||
| JP2002146461A | 2002-05-22 | |||
| JP2006257549A | 2006-09-28 |
Attorney, Agent or Firm:
Yoshihito Shimizu
Hisayoshi Shimizu
Ken Takada
Hisayoshi Shimizu
Ken Takada
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