Title:
METHOD OF MANUFACTURING CIRCUIT BOARD, METHOD OF MANUFACTURING LIGHT-EMITTING DEVICE, AND LIGHT-EMITTING DEVICE
Document Type and Number:
Japanese Patent JP2016208020
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To manufacture a circuit board that suppresses damage to an electrode, or to manufacture a light-emitting device that suppresses damage to an electrode.SOLUTION: A method of manufacturing a circuit board or a light-emitting device includes a step of preparing a processing member that includes a circuit and a terminal electrode on a first substrate, a separation layer on the terminal electrode, an adhesive layer on the separation layer, and a second substrate on the adhesive layer, performing cutting processing by using a blade that enables cutting processing by rotation to form a groove part on the processing member, and removing a part of the separation layer, the adhesive layer, and the second substrate so as to expose a part of the terminal electrode.SELECTED DRAWING: Figure 1
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Inventors:
NISHITO SUKENORI
SAKUISHI TATSUYA
SAKUISHI TATSUYA
Application Number:
JP2016078047A
Publication Date:
December 08, 2016
Filing Date:
April 08, 2016
Export Citation:
Assignee:
SEMICONDUCTOR ENERGY LAB CO LTD
International Classes:
H05K3/40; G06F3/041; G09F9/00; G09F9/30; H01L21/336; H01L27/32; H01L29/786; H01L51/50; H05B33/06; H05B33/10; H05B33/14; H05K1/02; H05K1/11; H05K3/00
Domestic Patent References:
| JP2014075318A | 2014-04-24 | |||
| JP2015015232A | 2015-01-22 | |||
| JP2005244007A | 2005-09-08 | |||
| JP2015046391A | 2015-03-12 | |||
| JP2012178262A | 2012-09-13 | |||
| JP2013251255A | 2013-12-12 |
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